DEEPX and Baidu Partner to Advance On-Device AI in Drones, Robotics, and OCR
DEEPX, an AI semiconductor company from South Korea, has formed a strategic partnership with Baidu, a global AI leader. This collaboration focuses on accelerating AI solutions for industrial applications such as drones, robotics, and optical character recognition (OCR) by leveraging Baidu’s open-source deep learning framework, PaddlePaddle.
Collaboration Built on PaddlePaddle
As an official ecosystem partner, DEEPX will engage in co-developing AI products compatible with Baidu’s PaddlePaddle platform and participate in global industrial AI projects. PaddlePaddle, China’s first open-source deep learning framework, supports fast data processing across diverse devices. It's widely used in smart cities, autonomous vehicles, image recognition, and speech processing, making it a key AI development tool in China.
PaddlePaddle offers a full-stack AI platform that covers the entire AI model lifecycle—from development to deployment—providing tools such as pre-trained models and visualization utilities. This foundation enables DEEPX to build AI semiconductors that integrate seamlessly with Baidu’s AI ecosystem.
Real-Time AI Performance on Edge Devices
Before signing the agreement, DEEPX demonstrated its mass-produced DX-M1 chip running Baidu’s fifth-generation PP-OCR and vision-language models at high frames per second (FPS) with excellent power efficiency. This is particularly significant for edge environments where battery and processing resources are limited.
The partnership will extend the use of these technologies beyond OCR to include drones and robotics. Baidu’s PaddlePaddle and ERNIE teams plan to compile AI models for drones and robots onto the DX-M1, enabling practical deployment in real-world projects.
Expanding Industry Adoption with AI Model Compatibility
DEEPX is converting 10 widely used OpenVINO-based AI models to be compatible with the DX-M1 chip. These models will be shared with Baidu’s global PaddlePaddle partners, simplifying AI adoption and scaling for customers worldwide.
In addition, DEEPX is developing the V-NPU, a dedicated neural processing unit card for vision AI designed to replace GPUs. Initial demos are complete, with mass production expected to start soon. Discussions are also underway to develop next-generation AI semiconductor products together, including prototypes based on Samsung Foundry’s 2nm process chip, DX-M2, to run Baidu’s large-scale AI model ERNIE-4.5-VL-28B-A3B.
Global Outreach and Demonstrations
DEEPX and Baidu will jointly exhibit at the 2025 Shenzhen Artificial General Intelligence Conference. They will showcase on-site demonstrations and conduct marketing activities to promote their AI solutions to international customers.
Strategic Impact on AI Product Development
Baidu’s PaddlePaddle and ERNIE teams highlight DEEPX’s low-power AI semiconductor technology as a critical addition to Baidu’s edge computing capabilities. The DX-M1 chip enhances practical use cases for AI models in OCR, robotics, and drones, helping companies implement AI solutions more easily across industries.
Lokwon Kim, CEO of DEEPX, emphasized that this partnership marks a key step for DEEPX in expanding its AI semiconductor technology across global industrial sites. By integrating with PaddlePaddle and ERNIE ecosystems, DEEPX aims to strengthen its position in the AI market through focused product development and industrial collaboration.
About DEEPX
DEEPX focuses on high-performance AI semiconductors and computing solutions that enable intelligence on electronic devices with an emphasis on energy efficiency. The company holds over 350 patents worldwide related to on-device AI chip development, making it one of the largest patent holders in this field.
DEEPX collaborates with prominent customers such as Hyundai Kia Motors Robotics Lab, POSCO DX, LGU+, and Inventec. Its partnerships extend to over 120 global organizations across smart cameras, surveillance systems, smart factories, robotics platforms, and AI servers. DEEPX actively promotes its technology in the US, China, Taiwan, and Europe.
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