$4M Seed Funding Set to Transform AI-Enabled Connected Device Manufacturing
Napino Tech Ventures and Teksun Microsys have launched Rapidise Technology with $4 million in seed funding. The goal is clear: change how AI-enabled connected devices are designed, engineered, and manufactured at scale.
Rapidise acts as a one-stop Original Design Manufacturer (ODM) for startups, SMBs, and enterprises building the next wave of AI-powered products. More than just manufacturing, Rapidise offers comprehensive services including design, prototyping, certification, and full product lifecycle management.
Unifying Engineering and Manufacturing
“Rapidise unites best-in-class product engineering with scalable manufacturing to accelerate AIoT innovation,” said Vaibhav Raheja, Board Director at Rapidise and Joint MD of Napino Auto. The company combines Teksun’s product design and engineering capabilities with Napino’s advanced electronics manufacturing infrastructure in India.
This vertical integration supports quick innovation and high-volume production across sectors like automotive, healthcare, industrial, and consumer electronics. Rapidise has already delivered over one million smart IoT devices and holds more than $81 million in booked orders across North America, Europe, the Middle East, and APAC.
A Vision for Intelligent, High-Performance Solutions
Founder and CEO Brijesh Kamani states, “Our vision is to be a world-leading ODM player, recognised for innovation, agility, and commitment to empowering intelligent, high-performance solutions.” By integrating engineering and manufacturing under one roof, Rapidise aims to streamline the development of AI-enabled IoT products.
Advanced Manufacturing Capabilities
Based in India, Rapidise runs fully automated, Japanese SMT lines within a Class 7 Clean Room environment, along with Camera Module Manufacturing in a Class 6 Clean Room. Their AI-powered PCB assembly lines, mechanical tooling, and full box-build assembly infrastructure enable the production of complex electronics, including:
- IoT modules and gateways
- Camera modules, dash cameras, and body-worn cameras
- 5G-enabled surveillance systems and automotive Edge AI devices
- Infotainment devices, smart TVs, and mobile phones
- Smart devices for Agri-tech, Fin-tech, Utilities, and Industry 4.0 applications
Accelerating Product Development with R&D and Modular Platforms
With a team of over 300 R&D engineers and modular, production-ready platforms called RISE IoT Modules, Rapidise speeds up custom IoT, AI, and connected solution development. This approach reduces engineering risk and shortens time-to-market.
“We’re transforming how products are built — from concept to mass production,” said Ashish Chinthal, Chief Business Officer at Rapidise. Their self-service platform allows instant quotes for engineering and manufacturing, making ODM services faster, more accessible, and fully transparent.
Collaborations to Boost AI and Connectivity Integration
Rapidise partners with semiconductor and connectivity companies to embed advanced AI, connectivity, and edge processing in its platforms. These collaborations help customers launch connected products faster and in larger volumes.
Manmeet Singh, Senior Director & India Business Head at Qualcomm India, added, “The collaboration showcases how ecosystem partnerships can accelerate scalable AI innovation. It’s a strong example of India-led co-innovation powering intelligent edge solutions globally.”
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